| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating capacitor, in which charges of large capacity are accumulated, whose manufacture is facilitated, and in which cost is reduced and reliability is improved, and also to provide a manufacturing method of the board. <P>SOLUTION: The printed wiring board 10 is provided with a capacitor element which is formed on the first face of a metal plate 11 serving as a core substrate, and has: a dielectric film 12; a conductive high molecular layer 13 formed on the first face of the dielectric film 12; and conductive layers 14 which are formed on the first face of the conductive high molecular layer 13 and are formed of copper plating. The conductive layers 14 are formed on the first face of the metal plate 11 and on the second face of an opposite side. A cathode electrode 25 on a first face-side of the printed wiring board is pulled out from the appropriate part of the conductive layer 14 on the first face. An anode electrode 26 on the second face of the printed wiring board is pulled out from the appropriate part of the conductive layer 14 on the second face of the metal plate 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
