| 发明名称 |
FILMY ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a filmy adhesive for a wafer back sticking method which can deal with a very thin wafer, and an adhesive sheet formed by sticking together the filmy adhesive and a UV-type dicing tape. <P>SOLUTION: The filmy adhesive is formed by containing a thermoplastic resin (A) and an epoxy resin (B), and the epoxy resin (B) is formed by containing 10-90 wt.% of a three or more functional epoxy resin (B1) with respect to the whole epoxy resin and 10-90 wt.% of a liquid epoxy resin (B2) with respect to the whole epoxy resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2006144022(A) |
申请公布日期 |
2006.06.08 |
| 申请号 |
JP20050342437 |
申请日期 |
2005.11.28 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MASUKO TAKASHI;HATAKEYAMA KEIICHI;OKUBO KEISUKE;YUSA MASAMI |
| 分类号 |
C09J7/00;C09J11/04;C09J163/00;C09J179/08;C09J183/08;H01L21/301;H01L21/52 |
主分类号 |
C09J7/00 |
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