| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize significant processing, manufacturing, inspection and the like which have not been experienced till now in a case when various processing, inspection or the like are carried out upon the manufacturing process of a printed circuit board. <P>SOLUTION: A cream solder printing device 11, a component mounting device 12 and a reflow device 13 are installed along the transfer line of the substrate. A printing condition inspecting device 21 is provided at the downstream side of the cream solder printing device 11. A mounting condition inspecting device 22 is provided at the downstream side of the component mounting device 12. A soldering condition inspecting device 23 and an electric conduction inspecting device 24 are provided at the downstream side of the reflow device 13. An IC tag arranging/writing device 10 is provided at the uppermost side and, in this case, an IC tag is arranged on the substrate to write necessary data in the manufacturing or the like. Reading/writing means 51, 52, 53, 54, which are capable of reading an information stored in the IC tag or writing newly the result of inspection or the like are provided so as to be corresponding to respective inspecting devices 21-24. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
