| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide low-temperature curable photosensitive compositions which are made flexible materials. <P>SOLUTION: The low-temperature curable photosensitive compositions containing a polyamic acid are developable in aqueous alkaline solutions and are curable at a temperature of at least 160°C and up to 200°C, to low modulus polyimides suitable for use in electronic circuit applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
