TRANSFER DEVICE AND TRANSFER METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a chip projection stage for sucking a diced semiconductor chip to a collet stably. SOLUTION: A square vacuum suction groove is formed at a region for supporting the inner edge of a chip adjacent to a chip picked up by the collet in a chip lifter, and a viscous sheet onto which a plurality of chips are applied is sucked by the chip lifter through a vacuum suction hole provided at the bottom surface of the groove. When picking up the chip by the collet, the chip is allowed to project by a projection block having area at a fixed ratio to that of the chip. COPYRIGHT: (C)2006,JPO&NCIPI