| 摘要 |
PROBLEM TO BE SOLVED: To solve the matter of a long thermal head that stress due to thermal expansion of an internal layer is accumulated and a heat dissipation layer and an insulating substrate becomes susceptible to peeling and cracking. SOLUTION: The thermal head comprises (a) an insulating substrate, (b) a heat dissipation layer composed of a metal film formed on the insulating substrate, (c) a thermal storage layer covering the heat dissipation layer, (d) a plurality of heating resistors formed on the thermal storage layer and arranged at a specified dot pitch in the main scanning direction, and (e) a wiring electrode group being connected electrically with each heating resistor. The heat dissipation layer is formed to be divided into a plurality of heat dissipators by slits formed at least at one position in the main scanning direction. COPYRIGHT: (C)2006,JPO&NCIPI
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