发明名称 |
IMPROVED INTEGRATED CIRCUIT SUBSTRATE MATERIAL AND METHOD |
摘要 |
A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface. |
申请公布号 |
KR20060061809(A) |
申请公布日期 |
2006.06.08 |
申请号 |
KR20067002188 |
申请日期 |
2006.01.31 |
申请人 |
AGILENT TECHNOLOGIES,INC. |
发明人 |
WONG MARVIN GLENN;FONG ARTHUR |
分类号 |
H01L27/12;C03C11/00;C03C14/00;H01L21/04;H01L29/26 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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