METHOD FOR MANUFACTURING DOUBLE-SIDED PRINTED GLASS BOARD

摘要

A through-hole (3) is filled with a copper film layer (5) composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate (1). The copper film layer (5) is formed by first forming an electroless plating copper layer (5a) and then forming an electrolytic plating copper layer (5b) on a sidewall of the through-hole (3). As a result, the front and rear surfaces of the double-sided wiring glass substrate (1) can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate (1) can be secured.