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发明名称
FORMATION METHOD OF SOLDER BUMPS USING THIN FILM HEATER FABRICATED ON IC CHIP OR IC CHIP WAFER AND THE FACILITY TO MAKE THE SAME
摘要
申请公布号
KR20060061327(A)
申请公布日期
2006.06.07
申请号
KR20060043763
申请日期
2006.05.16
申请人
OH, TAE SUNG
发明人
OH, TAE SUNG;CHOI, JAE HOON;JUNG, BOO YANG;LEE, KWANG YONG;JEON, YOUNG SOO
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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