发明名称 |
Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
摘要 |
<p>A circuit board which comprises a conductive pattern section 4 with a pattern formed on a conductive layer 3 provided on a board main body 2, wherein two or more bonding positions 6a, 6b, 6c that bumps of a part mounted by ultrasonic bonding strike are set in the conductive pattern section 4, characterized in that a notch part 8a or a recess extending from the margin of the conductive pattern section 4 to the inside thereof and reaching the proximity of the bonding position or an isolated notch part 8b or recess is formed in the conductive layer in the proximity of at least one bonding position. <IMAGE></p> |
申请公布号 |
EP0893946(B1) |
申请公布日期 |
2006.06.07 |
申请号 |
EP19980113678 |
申请日期 |
1998.07.22 |
申请人 |
TDK CORPORATION |
发明人 |
GOTOH, MASASHI;KANAZAWA, JITSUO;YAMAMOTO, SYUICHIRO;HONDO, KENJI |
分类号 |
H05K1/11;H05K3/34;H01L21/60;H01L21/607;H01L23/498;H05K1/02;H05K3/32;H05K3/38 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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