| 摘要 |
<p>The invention generally relates to methods and apparatus for ablating material using a light source, and more particularly to laser ablation of materials for molecular electronic devices, such as organic light emitting diodes. A method of ablating material using a light source is described. The method comprises shaping a beam from said light source such that on a surface of said material the beam has a shape with portions of different widths comprising a first width and a second narrower width; applying said beam to said surface to ablate material; and moving said beam relative to said surface such that material under a portion of said beam with second said narrower width receives more energy than material under a portion of said beam with said first width. The method, and corresponding apparatus, facilitates reduced debris laser ablation, particularly when ablating layered materials.</p> |
