发明名称 Power module and production method thereof
摘要 A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic components; a heat sink; and a member with insulation characteristics and high thermal conductivity, which is disposed between plural devices with high heating value among the above-mentioned electronic components and the above-mentioned heat sink, embeds at least part of each of the above-mentioned plural devices with high heating value therein and transfers heat from the above-mentioned plural devices with high heating value to the above-mentioned heat sink.
申请公布号 US7057896(B2) 申请公布日期 2006.06.06
申请号 US20030639195 申请日期 2003.08.11
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MATSUO MITSUHIRO;HANDA HIROYUKI;YOSHIDA KOJI;IKEDA SATOSHI;TAKESHIMA YOSHIHIRO
分类号 H05K7/20;H01L23/24;H01L23/373;H05K1/02;H05K3/28;H05K7/14 主分类号 H05K7/20
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