发明名称 |
Power module and production method thereof |
摘要 |
A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic components; a heat sink; and a member with insulation characteristics and high thermal conductivity, which is disposed between plural devices with high heating value among the above-mentioned electronic components and the above-mentioned heat sink, embeds at least part of each of the above-mentioned plural devices with high heating value therein and transfers heat from the above-mentioned plural devices with high heating value to the above-mentioned heat sink.
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申请公布号 |
US7057896(B2) |
申请公布日期 |
2006.06.06 |
申请号 |
US20030639195 |
申请日期 |
2003.08.11 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MATSUO MITSUHIRO;HANDA HIROYUKI;YOSHIDA KOJI;IKEDA SATOSHI;TAKESHIMA YOSHIHIRO |
分类号 |
H05K7/20;H01L23/24;H01L23/373;H05K1/02;H05K3/28;H05K7/14 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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