发明名称 |
Support system for semiconductor wafers and methods thereof |
摘要 |
A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.
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申请公布号 |
US7055229(B2) |
申请公布日期 |
2006.06.06 |
申请号 |
US20030748170 |
申请日期 |
2003.12.31 |
申请人 |
INTEL CORPORATION |
发明人 |
WILK BRIAN;JOYCE FRANK;KREAGER DOUGLAS;REPKO THOMAS A. |
分类号 |
B25B27/14;B24B37/04;H01L21/673;H01L21/683;H01L21/687 |
主分类号 |
B25B27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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