发明名称 Self-aligned buried contact pair and method of forming the same
摘要 A self-aligned buried contact (BC) pair includes a substrate having diffusion regions; an oxide layer exposing a pair of diffusion regions formed on the substrate; bit lines formed between adjacent diffusion regions and on the oxide layer, each of the bit lines having bit line sidewall spacers formed on sidewalls thereof; a first interlayer dielectric (ILD) layer formed over the bit lines and the oxide layer; a pair of BC pads formed between adjacent bit lines and within the first ILD layer, each BC pad being aligned with one of the pair of exposed diffusion regions in the substrate; and a pair of capacitors, each of the pair of BC pads having one of the pair of capacitors formed thereon, wherein a pair of the bit line sidewall spacers is adjacent to each of the BC pads and the pair of bit line sidewall spacers has an asymmetrical shape.
申请公布号 US7056786(B2) 申请公布日期 2006.06.06
申请号 US20040762380 申请日期 2004.01.23
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 YUN CHEOL-JU;CHO CHANG-HYUN;CHUNG TAE-YOUNG
分类号 H01L21/28;H01L21/8242;H01L21/02;H01L21/60;H01L21/768;H01L27/088;H01L27/108;H01L29/417 主分类号 H01L21/28
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