| 摘要 |
A honeycomb structure, and a process for production thereof, formed by bonding into one piece via a bonding layer a plurality of honeycomb segments, the honeycomb segment having an outer wall, partition walls provided inside the outer wall, and a large number of through-holes divided by the partition walls and extending in the axial direction of the segment; the outer wall and bonding layer having a relation: <?in-line-formulae description="In-line Formulae" end="lead"?>d*[(kappaa/da)+(kappac/dc)]>=kappa>=d*[(kappaa/da)+(kappac/dc)]x0.6<?in-line-formulae description="In-line Formulae" end="tail"?> wherein kappac (W/mK) and dc (cm) are respectively the thermal conductivity and thickness of the outer wall, kappaa (W/mK) and da (cm) are respectively the thermal conductivity and thickness of the bonding layer, and kappa (W/mK) and d (cm) are respectively the thermal conductivity and thickness of a layer which is the sum of the outer wall and the bonding layer.
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