发明名称 Heat dissipation device assembly with fan cover
摘要 A heat dissipation device assembly comprises a heat sink having a columniform conductive core and a plurality of fins arranged radially around the conductive core, a columnar fan cover housing the heat sink and defining a first open end and a second open end, and a fan located at the second open end of the fan cover. Pluralities of channels are formed between the radiation fins. A plurality of elongated slot surrounding the heat sink is defined in the fan cover and extends from the first open end of the fan cover to the second open end. The airflow provided by the fan travels through the channels and the slots to outside of the fan cover.
申请公布号 US7055578(B2) 申请公布日期 2006.06.06
申请号 US20040989762 申请日期 2004.11.16
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 KU CHIN-LONG;YEH CHIN-WEN
分类号 H05K7/20;G06F1/20;H01L23/34;H01L23/467 主分类号 H05K7/20
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