发明名称 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates
摘要 An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
申请公布号 US7057904(B2) 申请公布日期 2006.06.06
申请号 US20040896061 申请日期 2004.07.22
申请人 ALCATEL 发明人 BUNDZA NICHOLAS;LETOURNEAU FABIEN;CHESHIRE GREGORY WILLIAM
分类号 H05K7/14;H01R13/639;H04Q1/02;H05K1/14;H05K3/36;H05K7/10;H05K7/18 主分类号 H05K7/14
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