发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device and a method for fabricating the same are provided. The provided semiconductor device includes a field oxide layer formed in a semiconductor substrate to define an active region; gate structures formed on the active region; source/drain junctions formed on either side of the gate structures on the semiconductor substrate; a channel silicon layer arranged under the gate insulating layer to operate as a channel for connecting sources and drains; and buried junction isolation insulating layers under the channel silicon layer. The buried junction isolation insulating layers isolate source/drain junction regions of a MOS transistor, so that a short circuit in a bulk region under the channel of a transistor due to the high-integration of the device can be prevented.
申请公布号 US7057238(B2) 申请公布日期 2006.06.06
申请号 US20030452034 申请日期 2003.05.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JI-YOUNG;KIM KI-NAM
分类号 H01L27/092;H01L29/76;H01L21/336;H01L21/761;H01L21/8234;H01L21/8238;H01L29/06;H01L29/78 主分类号 H01L27/092
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