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发明名称
用以移除残余物之后蚀刻处理
摘要
本发明提供一种用以由基板上之导电材料层移除残余物的方法。在一实施例中,此方法包含导入制程气体至真空反应室中,该真空反应室具有因暴露于含氟环境下而有残余物生成其上之基板表面。制程气体包含含氢气体。或者,制程气体另包含含氧气体或含氮气体。制程气体之电浆之后系在真空反应室中维持一段预定时间以移除表面上的残余物。于电浆步骤中,基板温度系维持在大约10℃至大约90℃之间。
申请公布号
TW200618104
申请公布日期
2006.06.01
申请号
TW094139716
申请日期
2005.11.11
申请人
应用材料股份有限公司
发明人
江康烈;柴曼平;马绍铭;叶雁;谢彼得
分类号
H01L21/3065
主分类号
H01L21/3065
代理机构
代理人
蔡坤财
主权项
地址
美国
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