| 摘要 |
PROBLEM TO BE SOLVED: To provide a dividing method of a wafer capable of dividing the wafer along predetermined streets without deteriorating the quality of a micromachine. SOLUTION: The dividing method of a wafer, wherein there are formed on the surface of a wafer substrate 21 a plurality of micromachines and a plurality of streets 211 for comparting each micromachine, comprises a protective tape sticking process of sticking a protective tape 4 on the surface of the wafer 2; a cut groove forming process of cutting the wafer 2 on which the protective tape 4 is stuck along the streets from the back surface of the wafer substrate 21 of the wafer and hereby forming cut grooves 23, while leaving a stock removal of a predetermined thickness on the surface side of the wafer substrate 21; and a cutting process of cutting the stock removal by irradiating the cut margin of the cut grooves 23 formed along the streets 211 with laser light. COPYRIGHT: (C)2006,JPO&NCIPI |
