| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having a combination of favorably low stress and high adhesion, and to provide a highly reliable semiconductor device through using the resin composition as a die attach or heat sink attach material for semiconductors. SOLUTION: The resin composition having the above-mentioned advantage essentially comprises (A) a compound containing a structure of the general formula(1)( R<SP>1</SP>is a 3-6C hydrocarbon group; X is O, COO or OCOO; and n1 is an integer of 2-100 ) and having at least two radical-polymerizable carbon-carbon unsaturated bonds, (B) compound(s) of general formula(2)( R<SP>2</SP>is a 1-6C hydrocarbon group; R<SP>3</SP>is phenyl or a derivative thereof; and n2 is an integer of 2-100 ) and/or general formula(3)( R<SP>4</SP>is a 1-6C hydrocarbon group; and R<SP>5</SP>is phenyl or a derivative thereof ) and (C) a filler. The highly reliable semiconductor device through using the resin composition as a die attach or heat sink attach material for semiconductors is also provided. COPYRIGHT: (C)2006,JPO&NCIPI |
