| 摘要 |
PROBLEM TO BE SOLVED: To improve smear characteristics, while maintaining proper adhesion. SOLUTION: The solid-state imaging device comprises a photodiode, and a charge transfer for transferring a charge signal from the photodiode. A light-shielding film 13, that covers the charge transfer and a light-shielding film, that covers a base adhesion layer are both composed of a refractory metal or its silicide, wherein an opening is provided in the photodiode. Since a refractory metal or its silicide that constitutes the base adhesion layer is formed by means of sputtering method, the light-shielding films are formed via the base adhesion layer 12 which is composed of a titanium nitride layer or a titanium layer. COPYRIGHT: (C)2006,JPO&NCIPI
|
