| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin compositon which has a suppressed warpage by heat and is useful as an over-coating agent on a flexible printed wiring boad. SOLUTION: This resin composition contains (A) a resin having a polybutadiene structure on the molecule, (B) a thermosetting resin and (C) a compound having two or more mercapto groups in the molecule and/or a compound having two or more disulfide bonds in the molecule. COPYRIGHT: (C)2006,JPO&NCIPI
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