发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin molding material excelling in filling property while maintaining a fast injection speed. SOLUTION: The phenolic resin molding material contains a phenolic resin (a) having a weight average mol. wt. of 6,000-9,000 and a crystalline phenol compound (b) with two or more nuclei. It is preferable that the material further contains a polyolefin compound (c) having a weight average mol. wt. of 300-30,000 and that the above crystalline phenol compound (b) contains bisphenol F. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006137819(A) 申请公布日期 2006.06.01
申请号 JP20040327407 申请日期 2004.11.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 MURAYAMA HIDEKI;NISHIMURA MASAO
分类号 C08L61/06;C08K5/13;C08L23/00 主分类号 C08L61/06
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