| 摘要 |
A rectangular substrate dividing apparatus, which can divide a rectangular substrate in a smaller space, accommodate devices, formed as individual pieces by the division, into device cases, and pick up the devices reliably and efficiently from a protective tape affixed to the back of the rectangular substrate, is provided. This apparatus separates a rectangular substrate, to whose back a protective tape is affixed and on which a plurality of devices are partitioned by a lattice of scheduled-separation lines, along the scheduled-separation lines to divide the rectangular substrate into the individual devices, and accommodates the devices in device cases. In a cutting-responsible region, the rectangular substrate is carried out of cassettes, cut by a cutting means, and then cleaned by a cleaning means. In a tape peeling-responsible region, the devices are picked up with the protective tape being peeled off. In a device accommodation-responsible region, the picked-up individual devices are accommodated into device cases.
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