| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate for a semiconductor package on which a deflection does not occur. SOLUTION: The material for a semiconductor package has a fiber material and a resin material of 70 vol% or less, and is composed of at least one layer of a prepreg. The circuit substrate manufacturing method includes the steps of forming the prepreg layer of the maximum thickness 0.15 mm by a reel system, forming a conductive film to form a circuit pattern on at least one surface of the prepreg layer, and forming a predetermined circuit pattern on the conductive film. COPYRIGHT: (C)2006,JPO&NCIPI |
