发明名称 MOUNTING METHOD OF ELECTRONIC DEVICE, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting method capable of connecting, with high connection reliability, a connection wiring for connection to other conductive member to the connection terminal of an electronic device when mounting it on a board. <P>SOLUTION: The mounting method includes a process (a) in which a chip component 10 is placed on a circuit board 20 while an active surface (terminal forming surface) 12 where a connection terminal 14 is formed faces the side opposite to the circuit board 20, a conductor post forming process (b) in which a conductor post 38 is provided upright using a liquid phase method on the connection terminal 14 of the chip component 10 arranged on the circuit board 20, and a connection wiring forming process (d) in which a connection wiring 34 connected to the conductor post is formed on the circuit board 20 by the liquid phase method. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140270(A) 申请公布日期 2006.06.01
申请号 JP20040327712 申请日期 2004.11.11
申请人 SEIKO EPSON CORP 发明人 HAGIO YOSHITOMO
分类号 H01L21/60 主分类号 H01L21/60
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