| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device and a method of detecting a sticking object on a heat treatment plate, capable of detecting a minute sticking object on the heat treatment plate on which a substrate is placed for heat treatment. SOLUTION: A laser device 91 is provided to a PEB device 44. A first mirror 92, second mirror 93, and reflecting plate 95 are arranged around a hot plate 63. The laser beam outputted from the laser device 91 reflects on the surface of a wafer W on the hot plate 63, changes an angle, reflects on the first mirror 92, and reflects again on the surface of the wafer W. After reflected on the surface of the wafer W, it is reflected while changing the angle on the first mirror 92, and then reflected on the surface of the wafer W to enter the reflecting plate 95. The laser beam, reflected in the same direction with the incident direction by the reflecting plate 95, advances the same optical path to return to the laser device 91 for reception. A light shielding plate 94 in which a through hole is formed is arranged in front of the reflecting plate 95. The laser beam whose optical axis is deflected on the way due to tilting of the wafer W is shut off by the light shielding plate 94. By detecting presence of such laser beam as returned to the laser device 91, tilting of the wafer W is detected for detecting a sticking object on the hot plate 63. COPYRIGHT: (C)2006,JPO&NCIPI |
