| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having sufficiently low stress, high in reflow resistance and exhibiting high adhesion, and to provide a highly reliable semiconductor device through using the resin composition as a die attach or heat sink attach material for semiconductors. SOLUTION: The resin composition comprises (A) a reaction product obtained by reaction between a (meth)acrylamide compound having in the molecule an alcoholic hydroxy group, a compound whose both ends are alcoholic hydroxy groups, and a diisocyanate, (B) silver powder and (C) a compound of the general formula(1) (wherein, R<SP>1</SP>and R<SP>3</SP>are each an alkoxy; R<SP>2</SP>and R<SP>4</SP>are each an alkyl; (a) and b are each an integer of 1-3; m1 and m2 are each an integer of 1-5; and m3 is an integer of 2-4 ). COPYRIGHT: (C)2006,JPO&NCIPI |
