发明名称 |
Pb-free solder-connected structure and electronic device |
摘要 |
Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.
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申请公布号 |
US2006115994(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20060331220 |
申请日期 |
2006.01.13 |
申请人 |
SHIMOKAWA HANAE;SOGA TASAO;OKUDAIRA HIROAKI;ISHIDA TOSHIHARU;NAKATSUKA TETSUYA;INABA YOSHIHARU;NISHIMURA ASAO |
发明人 |
SHIMOKAWA HANAE;SOGA TASAO;OKUDAIRA HIROAKI;ISHIDA TOSHIHARU;NAKATSUKA TETSUYA;INABA YOSHIHARU;NISHIMURA ASAO |
分类号 |
H01L21/00;B23K1/00;B23K35/00;B23K35/26;C22C13/02;H01L23/50;H05K3/34 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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