Heat exchange device for power semiconductor module, has fluid conduit conducting cooling liquid and arranged between layers such that conduit is limited by both layers, where one layer has thermally conductive material

摘要

The device has a prefabricated layer group (21) with two layers (22, 23), and a fluid conduit (24) conducting cooling liquid (25). The fluid conduit (24) is arranged between the layers such that the conduit is limited by both the layers. One of the two layers exhibits a plastic film and a thermally conductive material. The thermally conductive material is selected from a ceramic group or a metal. Independent claims are also included for the following: (A) an arrangement with a heat exchange device (B) a method for manufacturing an arrangement with a heat exchange device.