| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of producing a small ceramic wiring substrate of high-density wiring on which refined and accurate soldered lands are formed. <P>SOLUTION: The method of producing the ceramic wiring substrate comprises a process of forming a number of wiring patterns 4 on a ceramic green sheet, a process of forming a line-shaped insulation pattern 28b, extending across a number of wiring patterns 4 and covering one end of the each pattern 4 to define a part of each pattern as a land 27, and a process of baking the ceramic green sheet with a number of the wiring patterns 4 and the insulation pattern 28b. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
