| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier and a manufacturing method thereof wherein the adherability between a wiring pattern (circuit) and a base material is so held that the wiring pattern does not drop off upon manufacture, and the base material can easily be peeled off after the manufacture of a semiconductor device; and to provide the semiconductor device using that tape carrier and a manufacturing method thereof. SOLUTION: In the tape carrier 11, electrically conductive metal foil of three-layer structure (a first copper foil layer 6, a peelable metal layer 7, and a second copper foil layer 8 in this order from the adhesive layer 2 side) is formed in a predetermined pattern 9 on an insulating film 1 provided with perforation holes 4 at predetermined positions via a adhesive layer 2, and a surface treatment layer 10 is formed on the surface thereof. After a semiconductor package is manufactured using this tape carrier 11, the peeling-off is carried out at the portion of the peelable metal layer 7. COPYRIGHT: (C)2006,JPO&NCIPI
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