| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a case for an electronic component capable of restraining reliability from deteriorating caused by the generation of warpage. SOLUTION: Warpage opposite to that produced due to the difference in the thermal expansion coefficients of a case body and the plate shaped composite 2 is imparted to the plate-shaped composite 2, beforehand. The plate-shaped composite is set in a metal mold 5 in a cooling process, and a melt 6 as the material of the case body is casted in the metal mold 5 and is cooled. Even though though in the cooling process, stress F2 acts due to the difference between the thermal expansion coefficients of the metal constituting the case body and a metal-based composite material constituting the plate-shaped composite 2 to cause the warpage on the case body and the plate-shaped composite 2, the warpage in the reverse direction has been imparted to the plate-shaped composite 2, beforehand, so that the surfaces of the case body and of the plate-shaped composite 2 are made flat, after the cooling. COPYRIGHT: (C)2006,JPO&NCIPI
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