发明名称 PRINTED BOARD UNIT, COMMUNICATION DEVICE, AND PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To cool a heating portion intensively by a low-cost structure. SOLUTION: The heat generated by a heating element 11 mounted on a printed board 10 is first transmitted to an earth pattern 14 which is formed on the opposite surface of the printed board 10 and is thermally connected to the heating element 11. Then is transmitted to a heat radiation fin 22 set up in a back wired board 21 via a heat-conducting clenching member 15 so arranged as to be in contact with the earth pattern 14 and a heat-conducting member 23 clenched by the clenching member 15, and finally is emitted outside. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140291(A) 申请公布日期 2006.06.01
申请号 JP20040328035 申请日期 2004.11.11
申请人 FUJITSU LTD 发明人 TOGASHI SAKAE;TAKANO TOSHIHARU;URATA KATSUYA;SUMIYOSHI MICHIO;KOTAKA SATOSHI;HIRAFUJI KAZUO;HASEGAWA YUJI;MIYAMOTO MANABU
分类号 H05K7/20 主分类号 H05K7/20
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