发明名称 FILM SUBSTRATE AND ADHESIVE TAPE
摘要 <p><P>PROBLEM TO BE SOLVED: To prepare an adhesive tape produced by using a film that is produced by using a non-halogen resin composition as a raw material, which solves problems concerning plasticity, manual cutting performance, and antiwear quality when the tape is used for binding complicated wires and cables in the engine room of a car, or the like. <P>SOLUTION: A film substrate or the adhesive tape contains, based on 100 pts.mass of an aromatic vinyl elastomer, 10 to 60 pts.mass of a styrene resin, 1 to 50 pts.mass of a maleimide copolymer prepared by polymerization of a 15 to 70 mass% aromatic vinyl monomer and a 30 to 85 mass% unsaturated dicarboxylic acid imide derivative, and 1 to 50 pts.mass of a nitrile copolymer prepared by polymerization of a 40 to 85 mass% aromatic vinyl monomer and a 15 to 40 mass% vinylcyanide monomer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006137883(A) 申请公布日期 2006.06.01
申请号 JP20040329921 申请日期 2004.11.15
申请人 DENKI KAGAKU KOGYO KK 发明人 HASUMI SUIKI;SAIDA SEIJI;SUZUKI KAZUO
分类号 C08L25/10;C08K3/00;C08L53/02;C09J7/02 主分类号 C08L25/10
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