| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which circuit component members are composed of a layer common to a connection conductive layer between a pad electrode and a bump electrode, and the connection conductive layer can be employed for other uses in order to enhance cost performance, and to provide its fabrication process. SOLUTION: On the pad electrode 11 of a semiconductor chip 10 in which an electronic circuit is formed and having the pad electrode 11 on the surface, a connection conductive layer is formed and a bump electrode 18 is formed on the upper layer thereof. A layer common to the connection conductive layer is formed on the semiconductor chip 10 and circuit component members, e.g. a resistive element R, are formed to be connected with the connection conductive layer. COPYRIGHT: (C)2006,JPO&NCIPI
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