发明名称 METHOD AND APPARATUS FOR BREAKING AND CUTTING FRAGILE MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To realize ideal breaking and cutting by preventing the disturbance caused by the disturbance of heat conduction occurring in the end part of a fragile material, in breaking and cutting the fragile material such as glass or the like by forming a scribe surface to the surface layer of the fragile material using the heat stress brought about by the heating due to the irradiation with a laser beam or the cooling due to the spraying of a cooling liquid and subsequently breaking the fragile material by the application of mechanical stress. <P>SOLUTION: The irradiation with the laser beam or the spraying of the cooling liquid is prevented by a mask in the end part of the fragile material not avoiding the disturbance of the scribe surface to stop the occurrence of a laser scribe surface. A break surface after scribing approaches an ideal state in a case free from a disturbed part as compared with a case that a disturbed scribe surface is present and the breaking and cutting of high quality of the fragile material can be realized. By performing the breaking and cutting of the fragile material, the enhancement of the quality dispensing with a post process of the broken and cut surface can be realized coupled with the excellent characteristics of laser scribing. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006137169(A) 申请公布日期 2006.06.01
申请号 JP20040357362 申请日期 2004.11.12
申请人 LEMI LTD 发明人 TAMURA YUTAKA
分类号 B28D5/00;B23K26/00;B23K26/18;C03B33/09 主分类号 B28D5/00
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