| 摘要 |
PROBLEM TO BE SOLVED: To form a multilayer structure provided with via holes by using a liquid drop ejector. SOLUTION: The method for forming a multilayer structure comprises a step for forming a conductive material pattern on the surface of an object by ejecting liquid drops of a conductive material, a step for forming a wiring pattern by calcinating the conductive material pattern, a step for forming a first insulating material pattern bordering the via hole on the wiring pattern by ejecting liquid drops of first insulating material containing a UV-curing material, a step for forming a first insulating pattern bordering the via hole by curing the first insulating material pattern, a step for rendering the surface of the object lyophilic, a step for forming a second insulating material pattern covering the wiring pattern and the surface of the object rendered lyophilic and surrounding the first insulating pattern by ejecting liquid drops of second insulating material containing a UV-curing material, and a step for forming the second insulating pattern surrounding the first insulating pattern by curing the second insulating material pattern. COPYRIGHT: (C)2006,JPO&NCIPI |
