WIRING BOARD AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which reduces a burden to a semiconductor chip and which can prevent the damage of the semiconductor chip and to provide a semiconductor device using it. SOLUTION: A connection pad 14A of one surface and circuit wiring 13A are located so that it may not be made to counter with the connection pad 14B of another side surface and circuit wiring 13B. COPYRIGHT: (C)2006,JPO&NCIPI