| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible circuit board mounter of high electrical reliability by preventing the peeling of a flexible circuit board from a pressure-bonding board. SOLUTION: In a board moving process, one or both of a pressure-bonding board and a flexible circuit board are moved, and the flexible circuit board and the pressure-bonding board are inserted between upper and lower pressure-bonding tools which are arranged to face the pressure-bonding board across the flexible circuit board arranged vertical to the pressure-bonding board and formed with an interval narrower than the width of the flexible circuit board, so that the flexible circuit board is so bent as to pinch the pressure-bonding board with the flexible circuit board. In a pressure-bonding process, the upper and lower pressure-bonding tools are used to pressure-bond both surfaces of the flexible circuit board and the pressure-bonding board at the same time, and to form a mounter connecting first and second wiring patterns to a connection terminal. COPYRIGHT: (C)2006,JPO&NCIPI
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