发明名称 |
Connection arrangement for micro lead frame plastic packages |
摘要 |
A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad each connected to the paddle. The first and second ground pads together with the paddle are configured to provide continuity of ground between the circuit board and a chip mounted to the paddle.
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申请公布号 |
US2006113646(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20040999591 |
申请日期 |
2004.11.30 |
申请人 |
CHANNABASAPPA ESWARAPPA;ANDERSON RICHARD A |
发明人 |
CHANNABASAPPA ESWARAPPA;ANDERSON RICHARD A. |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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