| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component capable of controlling characteristics such as a temperature coefficient of resistance (TCR), that can be varied only by heat treatment conditions, and capable of manufacturing a plate material for a resistance which has preferable characteristics, and to provide an electronic component using the plate material. <P>SOLUTION: The plate material of a copper-nickel alloy or a foil material 11a, the copper plate material or a foil material 11b, and the plate material of the copper-nickel alloy or the foil material 11a are laminated to form a lamination in which the copper plate material or the foil material 11b is thinner than the copper-nickel alloy plate material or the foil material 11a. The lamination is subjected to heat treatment to join each layer together in a state of solid solution. Preferably, the thickness ratio of the copper-nickel alloy plate material or the foil material 11a, the copper plate material or the foil material 11b, and the copper-nickel alloy plate material or the foil material 11a is in a range of 3:1:3 to 1,000:1:1,000, and the heat treatment is carried out at 1,123 K to 1,273 K. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
