发明名称 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
摘要 |
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.
|
申请公布号 |
US2006113562(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20060327073 |
申请日期 |
2006.01.06 |
申请人 |
JEUN GI-YOUNG;JEUN O-SEOB;LEE EUN-HO;LIM SEUNG-WON |
发明人 |
JEUN GI-YOUNG;JEUN O-SEOB;LEE EUN-HO;LIM SEUNG-WON |
分类号 |
H01L23/29;H01L23/495;H01L23/433;H01L25/04;H01L25/07;H01L25/18;H01L31/111 |
主分类号 |
H01L23/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|