发明名称 |
Printed circuit board including embedded capacitor and method of fabricating same |
摘要 |
Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method of fabricating the same.
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申请公布号 |
US2006115770(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20050058998 |
申请日期 |
2005.02.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HONG JONG K.;RYU CHANG S.;JEON HO S.;LEE SEOK K. |
分类号 |
G03C5/00 |
主分类号 |
G03C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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