发明名称 Printed circuit board including embedded capacitor and method of fabricating same
摘要 Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method of fabricating the same.
申请公布号 US2006115770(A1) 申请公布日期 2006.06.01
申请号 US20050058998 申请日期 2005.02.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HONG JONG K.;RYU CHANG S.;JEON HO S.;LEE SEOK K.
分类号 G03C5/00 主分类号 G03C5/00
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