发明名称 |
Micro-fluid ejection head containing reentrant fluid feed slots |
摘要 |
Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.
|
申请公布号 |
US2006115921(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20040001227 |
申请日期 |
2004.12.01 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
KRAWCZYK JOHN W.;MCNEES ANDREW L.;WARNER RICHARD L. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|