| 摘要 |
This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating- material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6'), the contact terminals (7') of which face essentially towards the second surface of the insulating- material layer and which is connected electrically by its contact terminals (7') to the conductor structures contained in the electronic module, is attached to the first component (6), and the contact terminals (7, 7') are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7'). By means of the invention, it is possible to achieve a simple module construction comprising two component layers, which permits the manufacture of smaller electronic devices than previously. |
