发明名称 MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a laminated ceramic electronic component wherein a good laminate is obtained and no structural defect of its sintered body is generated, and further, its productivity is made good. SOLUTION: In the manufacturing method of a laminated ceramic electronic component, the organic-binder component of its ceramic raw sheet contains at least a main-component resin having a high softening point and a subcomponent resin having a low softening point and a melted-mass flow rate of 1-10 g/10 min. Further, its heating performed pressingly in the process for creating its temporary laminate is performed at a heating temperature higher than the softening point of its subcomponent resin and lower than the softening point of its main-component resin. By this manufacturing method, a good laminate having no positional discrepancy and having no such structural defect as an interlayer peeling is so obtained as to be able to manufacture with a good productivity the laminated ceramic electronic component having the generation of no structural defect of its sintered body. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140379(A) 申请公布日期 2006.06.01
申请号 JP20040330216 申请日期 2004.11.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMURA MASARU;YAMAGUCHI TOMOKAZU;NAGAI ATSUO
分类号 H01G4/12;B28B11/00;H01G4/30 主分类号 H01G4/12
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