| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste superior in conductivity, a wiring board using it, its manufacturing method, and an electronic equipment using them. SOLUTION: When a wiring pattern 120 is formed on an insulating substrate 110 using a conductive paste having a conductive filler 130 and a binder 140 containing a thermoset resin, a biodegradable material, and microorganism, the biodegradable material in the binder 140 is made to be degraded by microorganisms, and the denseness between the conductive fillers 130 is made to be improved, thereby a wiring board 100 having a wiring pattern 120 superior in conductivity can be realized. COPYRIGHT: (C)2006,JPO&NCIPI
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