ADHESIVE COMPOSITION AND COVER LAY FOR FLEXIBLE PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To inhibit migration in a copper circuit. SOLUTION: An adhesive composition containing a thermosetting base polymer and a carboxylated acrylonitrile-butadiene rubber is used, wherein the content of a sulfonic acid compound contained in the adhesive composition is≤200 ppm per 1 total amount of solid matter in the adhesive composition. The adhesive composition inhibits elution of copper ions into the adhesive caused by corrosion of the copper circuit by the sulfonic acid compound and therefore inhibits reduction of insulation resistance in the copper circuit caused by formation of dendrites. COPYRIGHT: (C)2006,JPO&NCIPI